Three-layer boards
Short press times at low temperature
The industry
These boards are commonly used in furniture, module house production and housing facades. Typical challenges to producers are related to thickness tolerance of lamellas, cold material during winter time, rough surfaces, long assembly times, short potlife of adhesive systems and formation of resin pockets.
Our business concept in action
We'll help you tackle this challenges and achieve high productivity and high quality, by implementing a unique and integrated bonding solution consisting of:
Ultra-low-emitting formaldehyde adhesive systems offering short pressing times under low temperature conditions
Separate application technology
Automated quality control systems
Product range
Our solution range includes non-added formladehyde (NAF) adhesive systems based on EPI and PVAc, as well as melamine based systems (MUF).
The result:
Increased production volumes, optimal glue amounts, no potlife and minimal glue wastewater.