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Improving how materials bond

Adhesives - increasing thermal stability and mechanical strength

When used in waterborne adhesive formulations, colloidal silica can significantly increase the thermal stability and mechanical strength of bonded joints. Additionally, colloidal silica can help adjust viscosity, as well as shorten the drying time of film-forming organic dispersions.

Adhesives offer many advantages over other binding techniques: they facilitate the binding of different materials, they distribute stress across the joint more efficiently, they are often more cost-effective, they improve the esthetic outcome, and they increase design flexibility.

Unfortunately, adhesives also have several disadvantages, including decreased stability at high temperatures, relative weakness in bonding large objects with a small bonding surface area, and greater difficulty in separating objects during provisional testing.

Thankfully, adding colloidal silica dispersions to water-based adhesive formulations helps overcome a number of these disadvantages.

Depending on the specific application, colloidal silica can be added to improve heat resistance and shear strength and to reduce drying time. In addition, colloidal silica can be used to adjust the viscosity of adhesive formulations, without needing additional thickeners.

For more information:
We are here to help you to improve the efficiency of your adhesives. Please contact us for advice on which colloidal silica products are best for your applications.

See also:

Early human use of adhesive-like substances has been found dating back to 4000 B.C.; pots were repaired using sticky resins from tree sap.