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Surface Polishing

Creating the perfect substrate

Electronics Industry - Surface Polishing

Colloidal silica is used like "hi-tech sandpaper," for shaping, smoothing, and polishing silicon, glass, sapphire, and other precision substrate materials. It can produce low-defect and ultra-flat surfaces on silicon semiconductor and sapphire wafers, and flawless optical lenses.

In semiconductor and light-emitting-diode (LED) production, colloidal silica is a critical component for producing absolutely flat and uniform wafer surfaces. In both industries, colloidal silica performs equally well as a rough surface remover and final polishing additive, and eliminates the need for other surface preparation steps.

In chemical-mechanical planarization, colloidal silica is used to flatten out the irregularities in the films applied to the semiconductor substrates during integrated circuit fabrication.

With colloidal silica, different substrates (e.g., silicon, aluminum and sapphire) can be polished to a surface roughness of nanometer, or if needed Angstrom level. In all cases, wafers can be polished to low-defect and ultra-flat surfaces.

Colloidal silica is also a key component in the optical lens industry. Following the rough shaping of an optical substrate using a diamond stylus, it is polished to a deformation-free surface using colloidal silica.

For more information:
We are here to help you to improve the efficiency of your surface polishing. Please contact us for advice on which colloidal silica products are best for your applications.

See also:

Semiconductors can either conduct or block the flow of electrons. LEDs release energy in the form of photons; an effect called electroluminescence.